Experimental Investigation of the Effect of Two-Stage Peltier Application on the Temperature of a Microprocessor
Abstract
Increasing the number of transistors to enhance the performance of processors leads to overheating, creating a need for cooling. Traditional cooling methods with copper pipes are becoming outdated and insufficient, prompting the development of alternative cooling methods. In this study, a two stage Peltier module cooler was designed using Peltier modules, and its performance in cooling the processor was evaluated. The two stage Peltier module was created by thermally connecting two Peltier modules in series and tested under different experimental conditions. In the first experiment, the manufactured two-stage Peltier module was placed in the experimental setup with its surfaces exposed to air. Both the cold and hot surfaces were in contact with air, allowing heat transfer through natural convection. Afterward, power was supplied, and the surface temperatures were observed, and with the application of power, it was observed that the temperature of the hot surface increased from 34.8°C to 110.2°C, while the temperature of the cold surface rise from 24.2°C to 67.1°C. In the second experiment, a heat sink and a fan were mounted on the hot surface of the two stage Peltier module to evaluate cooling performance. As a result of these experiments, it was observed that with the application of the cooler, the minimum cold surface temperature dropped to -2.3°C, while the maximum hot surface temperature reached 26°C. In the third experiment, the Peltier modules cooling performance was tested on a micro heater instead of air. In these experiments, four different powers were applied to the micro-heater, and at the maximum power of 9.9 W, the lowest cold surface temperature observed was 126.4 °C. Finally, the two stage Peltier module system was directly applied to a computer processor to observe its cooling performance under real-use conditions. The experiments showed that the two stage Peltier module cooler reduced the processor temperature. In addition, under the same ambient conditions, it was observed that computer cooler reduced the microprocessor temperature to 62°C, while the cooler using the two-stage Peltier module reduced the microprocessor temperature to 43°C at the same microprocessor clock speed.
It was determined that as power was supplied to the Peltier module, the temperature difference between the two surfaces increased, but there was no significant change in the temperature of the hot surface. Additionally, it was observed that the performance of the Peltier module varied with different power values. The article demonstrates that the two stage Peltier module can be used as an effective solution for processor cooling applications.
Keywords
Thermoelectric cooler Processor cooler Two-stage Peltier module Temperature difference Cooling method
Ethical Statement
It is declared that during the preparation process of this study, scientific and ethical principles were followed, and all the studies benefited from are stated in the bibliography.
Supporting Institution
This work was supported by Sakarya University of Applied Sciences Scientific Research Projects Unit under Grants 195-2024
Project Number
195-2024
Thanks
Thank Sakarya University of Applied Sciences Scientific Research
References
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Abstract
Project Number
195-2024
References
- Y. Sun, N. B. Agostini, S. Dong, and D. Kaeli, “Summarizing CPU and GPU Design Trends with Product Data,” 2019, [Online]. Available: http://arxiv.org/abs/1911.11313.
- M. Bahiraei and S. Heshmatian, “Application of a novel biological nanofluid in a liquid block heat sink for cooling of an electronic processor: Thermal performance and irreversibility considerations,” Energy Convers. Manag., vol. 149, pp. 155–167, 2017, doi: 10.1016/j.enconman.2017.07.020.
- R. Chein and G. Huang, “Thermoelectric cooler application in electronic cooling,” Appl. Therm. Eng., vol. 24, no. 14–15, pp. 2207–2217, 2004, doi: 10.1016/j.applthermaleng.2004.03.001.
- N. Putra and W. N. Septiadi, “Improvement of heat pipe performance through integration of a coral biomaterial wick structure into the heat pipe of a CPU cooling system,” Heat Mass Transf. und Stoffuebertragung, vol. 53, no. 4, pp. 1163–1174, 2017, doi: 10.1007/s00231-016-1890-6.
- C. Gayner and K. K. Kar, “Recent advances in thermoelectric materials,” Prog. Mater. Sci., vol. 83, pp. 330–382, 2016, doi: 10.1016/j.pmatsci.2016.07.002.
- H. Jouhara et al., “International Journal of Thermo fl uids Thermoelectric generator ( TEG ) technologies and applications,” vol. 9, 2021.
- Sonal Renge, Yashika Barhaiya, Shikhar Pant, and Shubham Sharma, “A Review on Generation of Electricity using Peltier Module,” Int. J. Eng. Res., vol. V6, no. 01, pp. 453–457, 2017, doi: 10.17577/ijertv6is010308.
- M. Haci and Z. Kahraman, “Termoelektri̇k si̇stemli̇ yemek taşıma modülü tasarımı ve anali̇zi̇,” J. FCE, vol. 4, no. December, pp. 65–71, 2016.
- S. Shoeibi, H. Kargarsharifabad, M. Sadi, A. Arabkoohsar, and S. A. A. Mirjalily, “A review on using thermoelectric cooling, heating, and electricity generators in solar energy applications,” Sustain. Energy Technol. Assessments, vol. 52, no. PB, p. 102105, 2022, doi: 10.1016/j.seta.2022.102105.
- S. H. Zaferani, M. W. Sams, R. Ghomashchi, and Z. G. Chen, “Thermoelectric coolers as thermal management systems for medical applications: Design, optimization, and advancement,” Nano Energy, vol. 90, no. PA, p. 106572, 2021, doi: 10.1016/j.nanoen.2021.106572.
- H. Y. Zhang, Y. C. Mui, and M. Tarin, “Analysis of thermoelectric cooler performance for high power electronic packages,” Appl. Therm. Eng., vol. 30, no. 6–7, pp. 561–568, 2010, doi: 10.1016/j.applthermaleng.2009.10.020.
- M. ŞAHİN and P. D. H. IŞIK, “Zorlu Ortam Koşullarında Çalışan Bilgisayarlar için Geliştirilen Peltier Etki ile Soğutulan Sıvı Soğutma Sisteminin Fanlı Soğutma Sistemi ile Karşılaştırılması,” Sürdürülebilir Mühendislik Uygulamaları ve Teknol. Gelişmeler Derg., vol. 6, no. 2, pp. 156–166, 2023, doi: 10.51764/smutgd.1318383.
- M. TOREN and H. MOLLAHASANOGLU, “Termoelektrik Soğutma Sisteminin Alternatif Transformatör Soğutma Sistemi Olarak Performansı,” Eur. J. Sci. Technol., no. 32, pp. 498–507, 2022, doi: 10.31590/ejosat.1039820.
- M. A. Ali Khan, E. Uzgören, and A. Muhtaroǧlu, “Investigation of secondary cooling design enhancements in thermally limited compact notebooks,” Turkish J. Electr. Eng. Comput. Sci., vol. 25, no. 2, pp. 1574–1586, 2017, doi: 10.3906/elk-1602-50.
- W. Y. Chen, X. L. Shi, J. Zou, and Z. G. Chen, “Thermoelectric coolers for on-chip thermal management: Materials, design, and optimization,” Mater. Sci. Eng. R Reports, vol. 151, no. August, p. 100700, 2022, doi: 10.1016/j.mser.2022.100700.
- Z. Liu et al., “Design and optimization of a cubic two-stage thermoelectric cooler for thermal performance enhancement,” Energy Convers. Manag., vol. 271, no. September, p. 116259, 2022, doi: 10.1016/j.enconman.2022.116259.
- S. Çobaner, “Termoelektrik Yöntemler ile Mikroişlemci Soğutucu Tasarımı,” Sakarya Uygulamalı Bilimler Üniversitesi, 2024.
Details
| Primary Language | English |
|---|---|
| Subjects | Control Engineering, Mechatronics and Robotics (Other) |
| Journal Section | Research Article |
| Authors | |
| Project Number | 195-2024 |
| Early Pub Date | December 25, 2024 |
| Publication Date | December 31, 2024 |
| Submission Date | September 10, 2024 |
| Acceptance Date | October 25, 2024 |
| Published in Issue | Year 2024Volume: 7 Issue: 3 |
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